Semiconductor Industry and Vaccum Chambers
G.AL® Cast Plates in the Semiconductor Industry
Using G.AL® Cast Plates in the semiconductor industry and vacuum chambers
Modern technology is ever evolving – largely thanks to advances in the semiconductor industry and the improvements in modern chip technology. The semiconductor industry is growing at great rates and the production methods are becoming more and more sophisticated. Our G.AL® Cast Plates offer a multitude of advantages that make them ideal for vacuum and semiconductor production processes.
Low outgassing
Due to the GLEICH Factory Standard, which limits the alloy components in our products drastically in order to ensure the highest quality, GAL® Cast Plates in general, but – due to their very low silicon content – specifically G.AL® C210R and G.AL® C250 (EN AW 5083), have very low outgassing properties.
These materials release a minimum of gas molecules in vacuum environments. The minimal outgassing decreases the risk of contamination in clean room environments and thereby ensures the purity and integrity of semiconductor manufacturing processes.
Additionally, components made out of GAL® Cast Plates can be manufactured with very smooth surface finishes, further decreasing the risk of the generation of unwanted particles.
High Vacuum Compatibility
While G.AL® C330R and G.AL® C330 (EN AW 7021) are only suitable for a low and rough vacuum, G.AL® C210R and G.AL® C250 can be used in high vacuums of up to 10-7mbar.
G.AL® Specialty Plate G.AL® C210 DYNAMIC can even be used in ultra-high vacuums of up to 10-13 mbar.
See the guide G.AL® Cast Plates for Vacuum Applications for more details.
Corrosion resistance
GAL® Cast Plates have excellent resistance to corrosion and can therefore withstand exposure to various gases and chemicals used in semiconductor processing without significant degradation. This resistance to chemical reaction ensures long-term reliability in vacuum environments.
The natural oxide coating from aluminum works as a barrier that reduces the diffusion of contaminants such as oxygen, carbon of hydrogen. Various types of surface treatments such as can even amplify this effect:
- mechanical surface treatments (grinding, blasting, brushing, polishing
- chemical surface treatments (cleaning, degreasing, pickling, etching)
- anodic oxidation (anodizing, hard anodizing)
- organic coating processes (such as various painting processes)
One important use of G.AL® Cast Plates in semiconductor production is as backing plates in the process of sputtering, or vapor deposition.
Thermal Stability
GAL® Cast Plates have set the standard for dimensional stability and structural integrity even under fluctuating temperatures, which are often encountered in vacuum systems. This stability reduces the risk of dimensional changes that could compromise vacuum seals.
G.AL® C210R and G.AL® C250 (EN AW 5083) are both more resistant to temperature changes than our G.AL® Cast Plates in alloy EN AW 7021. This is because as non-heat-treatable alloys they are very resistant to recrystallization and therefore permanent loss of mechanical properties.
In conclusion, G.AL® Cast Plates have many possible applications in the semiconductor industry for constructing vacuum chambers and facilitating the overall manufacturing processes. Their low outgassing, high vacuum compatibility, chemical compatibility and thermal stability, make them the material of choice for vacuum applications within this high-quality industry.