Semiconductors and Vacuums
G.AL® Cast Plates in Semiconductors and Vacuum Chambers
G.AL® Cast Plate Advantages
Technology is constantly evolving—largely due to advances in semiconductor and modern chip technologies. As the semiconductor industry rapidly grows, production methods are becoming increasingly sophisticated. G.AL® Aluminum Cast Plates offer advantages that make them ideal for vacuums and semiconductor manufacturing.
Low Outgassing
The GLEICH Factory Standard limits the alloy components in our products. All G.AL® Cast Plates—but specifically G.AL® C210R and G.AL® C250 (EN AW 5083)—exhibit extremely low outgassing because of their low silicon content.
Outgassing refers to the release of gas molecules from a solid material, which can contaminate vacuums or sterile environments.
Our materials emit minimal gas in vacuum settings, reducing the risk of contamination and keeping semiconductor manufacturing environments sterile.
To reduce outgassing even further, G.AL® Cast Plates can be machined to a fine surface finish with no visible microporosity, further decreasing the risk of unwanted contaminants.
High Vacuum Compatibility
G.AL® Cast Plates easily withstand high vacuum conditions
common in semiconductor processing.
While G.AL® C330R and G.AL® C330 (EN AW 7021) are only suitable for low and rough vacuums,
G.AL® C210R and G.AL® C250 can be used in high vacuums up to 10-7 mbar.
G.AL® Specialty Plate G.AL® C210 DYNAMIC can even be used in ultra-high
vacuums up to 10-13 mbar.
See the G.AL® Cast Plates for Vacuums Guide for more details.
Corrosion Resistance
G.AL® Cast Plates offer outstanding corrosion resistance, withstanding exposure to gases and chemicals used in semiconductor processing. This resistance to chemical reactions ensures long-term reliability in vacuum systems.
Aluminum naturally forms a protective oxide layer, which acts as a barrier against the diffusion of contaminants such as oxygen, carbon, and hydrogen (learn more about corrosion HERE). This protection can be enhanced with surface treatments, including:
- Mechanical surface treatments (grinding, blasting, brushing, polishing)
- Chemical surface treatments (cleaning, degreasing, pickling, etching)
- Anodic oxidation (anodizing, hard anodizing)
- Organic coatings (such as specialized painting processes)
G.AL® Cast Plates are also used in semiconductor manufacturing as backing plates in sputtering or vapor deposition processes.
Thermal Stability
G.AL® Cast Plates are known for dimensional stability and structural integrity, even under fluctuating temperatures common in vacuums. This thermal stability minimizes the risk of dimensional changes that could compromise vacuum seals. G.AL® C210R and G.AL® C250 (EN AW 5083) are more resistant to temperature changes cast plates made from EN AW 7021 alloy. As non-heat-treatable alloys, they are highly resistant to recrystallization and permanent loss of mechanical properties.
G.AL® Cast Plates have many uses in the semiconductor industry for constructing vacuum chambers and supporting overall manufacturing processes. Their low outgassing, high vacuum compatibility, chemical resistance, and thermal stability make them the go-to material for demanding vacuum applications