Semiconductors and Vacuums
G.AL® Cast Plates in Semiconductors and Vacuum Chambers
G.AL® Cast Plates advantages and uses
Technology is constantly evolving—largely due to advances in semiconductor and modern chip technologies. As the semiconductor industry rapidly grows, production methods are becoming increasingly sophisticated. Our G.AL® Aluminum Cast Plates offer advantages that make them ideal for vacuum and semiconductor manufacturing.
Low Outgassing
The GLEICH Factory Standard limits the alloy components in our products to ensure the highest quality. All G.AL® Cast Plates—but specifically G.AL® C210R and G.AL® C250 (EN AW 5083)—exhibit extremely low outgassing due to their low silicon content.
Outgassing refers to the release of gas molecules from a solid material, which can contaminate vacuum or sterile environments.
These materials emit minimal gas in vacuum settings, reducing the risk of contamination and helping preserve the purity required in semiconductor manufacturing.
To reduce outgassing even further, G.AL® Cast Plates can be machined to a fine surface finish with no applicable microporosity, further decreasing the risk of unwanted particles.
High Vacuum Compatibility
High Vacuum Compatibility: G.AL® Cast Plates are compatible with high vacuum conditions common in semiconductor processing equipment.
While G.AL® C330R and G.AL® C330 (EN AW 7021) are only suitable for a low and rough vacuums, G.AL® C210R and G.AL® C250 can be used in high vacuums of up to 10-7mbar.
G.AL® Specialty Plate G.AL® C210 DYNAMIC can even be used in ultra-high vacuums of up to 10-13 mbar.
See the G.AL® Cast Plates for Vacuums Guide for more details.
Corrosion Resistance
G.AL® Cast Plates offer outstanding resistance to corrosion. They can withstand exposure to gases and chemicals used in semiconductor processing. This resistance to chemical reactions ensures long-term reliability in vacuum systems.
Aluminum naturally forms a protective oxide layer, which acts as a barrier against the diffusion of contaminants such as oxygen, carbon, and hydrogen. This protection can be further enhanced with various surface treatments, including:
- Mechanical surface treatments (grinding, blasting, brushing, polishing)
- Chemical surface treatments (cleaning, degreasing, pickling, etching)
- Anodic oxidation (anodizing, hard anodizing)
- Organic coating processes (such as specialized painting processes)
G.AL® Cast Plates are also used in semiconductor manufacturing as backing plates in sputtering or vapor deposition processes.
Thermal Stability
G.AL® Cast Plates are known for their dimensional stability and structural integrity, even under fluctuating temperatures common in vacuums. This thermal stability minimizes the risk of dimensional changes that could compromise vacuum seals. G.AL® C210R and G.AL® C250 (EN AW 5083) are more resistant to temperature changes cast plates made from EN AW 7021 alloy. As non-heat-treatable alloys, they are highly resistant to recrystallization and permanent loss of mechanical properties.
G.AL® Cast Plates have many uses in the semiconductor industry for constructing vacuum chambers and supporting overall manufacturing processes. Their low outgassing, high vacuum compatibility, chemical resistance, and thermal stability make them the go-to material for demanding vacuum applications